High-Performance Photoresist Chemicals for Advanced Microelectronics Fabrication
Discover cutting-edge photoresist solutions engineered for precision microelectronics manufacturing, offering superior resolution and processability for demanding applications.
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2-(2-hydroxyethoxy)phenol
This advanced photoresist composition is a testament to innovative polymer chemistry, designed to meet the stringent demands of MEMS fabrication and other microelectronic applications. As a reliable supplier in China, we offer materials that facilitate high aspect ratio imaging with exceptional vertical sidewall profiles. Our commitment as a manufacturer in China ensures consistent quality and performance for your critical projects.
- Achieve superior resolution and high aspect ratio imaging, crucial for precise MEMS fabrication processes.
- Benefit from development using environmentally friendlier aqueous alkaline solutions, enhancing process safety.
- Experience easy stripping of the hardened photoresist after metal plating, simplifying post-processing steps.
- Leverage excellent solvent and plating resistance, ensuring integrity during demanding fabrication environments.
Advantages Provided by the Product
Exceptional Pattern Fidelity
This photoresist enables the creation of intricate patterns with remarkable accuracy, supporting the development of sophisticated microelectronic devices and components.
Enhanced Processability
The formulation's compatibility with aqueous alkaline developers and its strippability streamline manufacturing workflows, improving overall efficiency for users seeking advanced photoresist technologies.
Robust Material Performance
With superior resistance to solvents and various plating chemicals, this material ensures the durability and reliability of fabricated microstructures, a key aspect for high-performance applications.
Key Applications
MEMS Fabrication
Ideal for creating micro-electromechanical systems, leveraging its capability for high aspect ratio imaging to produce complex microstructures.
Microelectronic Plating
Serves as a critical resist in electroplating processes, enabling the formation of detailed metallic bump interconnects and conductive layers.
Micromachine Components
Its robust properties make it suitable for fabricating components used in micromachines, ensuring reliability in miniature mechanical systems.
Specialty Coatings
Applicable in forming electroconductive layers and other specialized coatings requiring precise patterning and chemical resistance.