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Achieve superior adhesion and surface preparation for your copper plating needs.

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Advantages Provided by the Product

High Efficiency

Rapidly prepares non-metal substrates for copper plating, significantly improving the bonding process and ensuring high adhesion plating pre-treatment.

Long Shelf Life

With a shelf life of up to three years when unopened, this product offers reliable and extended usability, making it a cost-effective solution.

User-Friendly Application

The straightforward immersion process simplifies the application, making it accessible for various technical levels in metal finishing surface preparation.

Key Applications

Metal Finishing

An ideal solution for preparing non-metallic components within the demanding metal finishing surface preparation sector, ensuring durable coatings.

Plating Processes

Perfect for pre-treating surfaces before applying copper coatings or plating, facilitating seamless integration into existing workflows.

Industrial Manufacturing

Essential for ensuring quality and durability in manufactured products by enhancing surface adhesion, crucial for high adhesion plating pre-treatment.

Electronics

A valuable component in the electronics industry for preparing substrates before copper plating processes, contributing to reliable performance.