2-N-Undecylimidazole: High-Performance Epoxy Curing Agent for Advanced Materials
Unlock superior epoxy resin performance with our advanced latent curing catalyst.
Get a Quote & SampleProduct Core Value

2-N-Undecylimidazole
Experience the power of 2-N-Undecylimidazole, a cutting-edge long-chain alkylimidazole derivative engineered to be a high-performance catalyst for epoxy resin curing. It delivers unparalleled latency and thermal stability, crucial for demanding applications. Its unique hydrophobic tail significantly improves compatibility within polymer matrices, facilitating precise and controlled curing processes essential for the development of advanced composites, high-strength adhesives, and reliable electronic encapsulants.
- Discover the advantage of enhanced polymer compatibility thanks to its hydrophobic tail, enabling controlled curing for advanced composites.
- Leverage its superior latency and thermal stability for reliable performance in high-temperature environments.
- Utilize this versatile chemical as a corrosion inhibitor and surfactant intermediate for broader application.
- Benefit from its role as a ligand in organometallic catalysis, opening new avenues for chemical synthesis.
Key Advantages
Precise Curing Control
Achieve delayed curing kinetics with 2-N-Undecylimidazole, allowing for extended pot life and improved processability for your epoxy formulations.
Enhanced Thermal Performance
Benefit from the superior thermal stability offered by this compound, ensuring consistent performance even in elevated temperature applications.
Broad Material Compatibility
Its hydrophobic tail ensures excellent compatibility with a wide range of polymer matrices, simplifying formulation and improving final product properties.
Key Applications
Advanced Composites
Utilize 2-N-Undecylimidazole for controlled curing in the manufacturing of high-performance advanced composites, achieving superior mechanical properties.
High-Strength Adhesives
Formulate robust adhesives with enhanced latency and stability, ensuring reliable bonding in critical applications.
Electronic Encapsulation
Protect sensitive electronic components with reliable encapsulation solutions that benefit from controlled curing and excellent thermal stability.
Specialty Chemical Uses
Explore its utility as a corrosion inhibitor, surfactant intermediate, and in organometallic catalysis for diverse chemical industry needs.