Diallyl Bisphenol A (CAS 1745-89-7): Enhancing Thermoset Resin Performance and Applications

Unlock superior performance in thermoset resins with our advanced Diallyl Bisphenol A.

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Key Advantages Offered

Enhanced Thermal Stability

By improving the cross-linked density of thermoset epoxies, DBA enables materials to withstand extreme temperatures, crucial for aerospace and electronics. Learn more about diallyl bisphenol a in aerospace structural materials.

Superior Mechanical Performance

DBA reinforces toughness and fatigue resistance, making it ideal for structural adhesives and high-performance composites. Discover how diallyl bisphenol a can improve the mechanical property of epoxy material.

Processing Flexibility

With tunable reactivity, DBA integrates seamlessly into various curing processes, from coatings to advanced composites. Explore the benefits of using DBA as a thermoset resin modifier.

Key Applications

Electrical Insulation

Used in electrical insulation materials, copper-clad circuit boards, high-temperature impregnating varnishes, and insulating varnish laminates, highlighting its role in electronic applications.

Wear-Resistant Materials

Ideal for diamond grinding wheels, heavy-duty grinding wheels, and brake pads, showcasing its contribution to durable, high-performance components.

Aerospace Structures

Serves as a component in aerospace structural materials, demonstrating its capability to meet stringent performance requirements in demanding environments.

Rubber Antioxidant

Acts as an antioxidant for rubber, significantly improving its aging resistance when added in quantities of 1-3%, a key benefit for the rubber industry.