Unlock the Potential of Mesophase Pitch-Based Carbon Fiber

Experience unparalleled thermal management and structural integrity for your most demanding applications.

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Key Advantages Offered

Superior Thermal Performance

Achieve efficient heat dissipation with our material, ideal for 5G chip heat management solutions, ensuring optimal operation of high-power electronic components.

Exceptional Mechanical Strength

Benefit from the high modulus properties, making it suitable for demanding structural applications in aerospace and heavy-duty equipment where strength is paramount.

Advanced Functional Properties

Utilize its excellent electrical conductivity and electromagnetic shielding capabilities, crucial for protecting sensitive electronic systems and improving signal integrity.

Key Applications

5G Chip Heat Dissipation

Effectively manage heat in high-power 5G devices with our advanced material, addressing the critical need for reliable thermal management.

Aerospace Components

Meet the stringent requirements for aerospace applications, benefiting from the low thermal expansion coefficient and high strength in aircraft and space vehicles.

High-Power Electronic Substrates

Ensure stable operation of high-power electronics in automotive and industrial settings with substrates offering superior thermal conductivity.

High-Temperature Industrial Processes

Withstand extreme conditions in industrial furnaces and rocket motor nozzles, showcasing the material's robustness in high-temperature environments.