Diethylene Glycol Dimethacrylate, commonly abbreviated as DEGDMA (CAS 2358-84-1), is a chemical compound that plays a significant role in various industrial applications, particularly in polymer science. As a dedicated manufacturer and supplier of fine chemicals, understanding the technical aspects of DEGDMA is vital for our clients, including R&D scientists and procurement specialists. This overview delves into its properties, structure, and fundamental applications.

Chemical Structure and Properties of DEGDMA

DEGDMA is a diester of methacrylic acid and diethylene glycol. Its molecular formula is C12H18O5, giving it a molecular weight of approximately 242.27 g/mol. The presence of two methacrylate functional groups makes it a difunctional monomer, capable of forming extensive cross-linked polymer networks when polymerized.

Key physical and chemical properties often cited for DEGDMA include:

  • Appearance: Typically a colorless to pale yellow liquid.
  • Viscosity: Low viscosity, which is advantageous for processing and formulation.
  • Boiling Point: Approximately 134 °C at 2 mmHg, indicating its relatively low volatility under standard conditions.
  • Solubility: Soluble in common organic solvents like chloroform, ethyl acetate, and methanol, but generally insoluble in water.
  • Stability: It is often stabilized with inhibitors such as MEHQ (monomethyl ether hydroquinone) to prevent premature polymerization during storage and transport. DEGDMA is also noted to be light-sensitive.
  • Density: Around 1.082 g/mL at 25°C.

Core Applications of DEGDMA

The difunctional nature of DEGDMA allows it to act as a crucial cross-linking agent in polymerization reactions. Its primary uses include:

  • Polymer Synthesis: It is used to create cross-linked polymers, enhancing mechanical strength, thermal stability, and chemical resistance.
  • Dental Materials: In dental composites and resins, DEGDMA improves the durability, hardness, and wear resistance of restorations.
  • Coatings: Employed as a reactive diluent and cross-linker in UV-curable coatings, providing excellent scratch resistance and adhesion.
  • Adhesives: Enhances the strength, flexibility, and curing speed of various adhesive formulations.
  • Electronics: Used in encapsulation and insulation materials due to its dielectric properties.

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