High Purity Tin Alloy Solder Powder for Advanced Electronics Manufacturing

Discover the precision and performance of spherical, high-purity solder powder for your critical applications.

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Advantages Offered

Enhanced Conductivity

The tin-silver-lead alloy composition provides excellent electrical and thermal conductivity, essential for high-performance electronic circuits and conductive materials applications.

Process Consistency

Engineered with a consistent spherical shape and controlled particle size, this powder ensures predictable performance in solder paste formulations and powder metallurgy, minimizing process variability.

Application Versatility

Ideal for use in solder paste products, welding materials, conductive materials, and powder metallurgy, this tin alloy solder powder offers broad applicability across various industries.

Key Applications

Solder Paste Manufacturing

This high purity solder powder is a critical ingredient for creating high-quality solder pastes used in surface mount technology (SMT) and other electronic assembly processes.

Conductive Materials

Its metallic properties and controlled particle size make it suitable for developing advanced conductive materials for various electronic components and applications.

Powder Metallurgy

The powder's spherical morphology and purity are advantageous for creating dense and strong parts through powder metallurgy techniques, including in superhard materials.

Welding Applications

As a key component in welding materials, this Sn62Pb36Ag2 solder powder contributes to strong and reliable metallurgical bonds.