4,4'-Diaminodiphenylsulfone
- CAS No.80-08-0
- GradeIndustrial / Pharmaceutical
- Availability● In Stock
High-purity 4,4'-Diaminodiphenylsulfone (CAS 80-08-0) designed for advanced polymer synthesis. Ideal for producing heat-resistant polysulfone amide resins with superior thermal stability.
Request Bulk PricingProduct Technical Details
Product Overview
4,4'-Diaminodiphenylsulfone, frequently recognized by its chemical synonyms such as DDS or Dapsone in specific pharmaceutical contexts, stands as a critical aromatic diamine within the high-performance materials sector. Our facility specializes in the production of this essential intermediate, delivering consistent quality tailored for demanding industrial applications. The compound features a robust sulfone bridge linking two aniline groups, providing exceptional thermal and oxidative stability to downstream polymers. As a key building block, it enables the creation of engineering plastics that withstand extreme environments, making it indispensable for aerospace, automotive, and electronic industries.
Technical Specifications
We adhere to strict quality control protocols to ensure every batch meets rigorous international standards. The following table outlines the typical physical and chemical properties of our industrial grade 4,4'-Diaminodiphenylsulfone. Our manufacturing process optimizes purity levels to minimize impurities that could affect polymerization reactions.
| Parameter | Specification |
|---|---|
| CAS Number | 80-08-0 |
| Molecular Formula | C12H12N2O2S |
| Molecular Weight | 248.30 g/mol |
| Appearance | White powder |
| Purity | ≥99.5% |
| Melting Point | 175-177 °C |
| Boiling Point | 511.7 °C at 760 mmHg |
| Density | 1.361 g/cm3 |
Industrial Applications
The primary utility of 4,4'-Diaminodiphenylsulfone lies in the synthesis of polysulfone amide resins and other high-performance polymers. Its unique chemical structure imparts excellent mechanical strength and heat resistance to the final material. Beyond polysulfones, this aromatic diamine serves as an effective curing agent for epoxy resins, enhancing their chemical resistance and thermal properties. It is also utilized in the production of polyimide films and composite materials required in advanced electronics and insulation systems. Manufacturers seeking to improve the durability and performance of their polymer formulations rely on this intermediate for its consistent reactivity and stability during processing.
Quality Assurance and Packaging
Our commitment to excellence extends beyond synthesis to comprehensive quality assurance. Each production lot undergoes thorough analysis using HPLC and GC methods to verify purity and composition. We provide a Certificate of Analysis (COA) with every shipment to ensure transparency and compliance with your internal standards. Regarding logistics, the product is packaged in 25kg moisture-proof bags to maintain integrity during transit. Storage recommendations include keeping the warehouse ventilated at low temperatures, separated from food materials to prevent contamination. As a global manufacturer, we offer competitive bulk pricing and reliable shipping solutions to support your supply chain needs efficiently.
